CleanerSolutions Database
Toxics Use Reduction Institute · Surface Solutions Laboratory
 
Toxics Use Reduction Institute




Surface Solutions Laboratory

Client Information



Client Number 20 (Electronics Manufacturer)


Client Images:

Client Image http://www.cleanersolutions.org/downloads/client_images/020A.jpg   


Project Number 1



Summary: After testing several cleaners, one was found to work well. Church & Dwight Armakleen E2002 was suggested by the lab. A summer intern was hired to implement the testing.

Test Objective: To deflux electronic assemblies

Problems with Current Method: Genesolve 2004 has to go away (HCFC 141 B)

Purpose of Cleaning: To remove flux to eliminate ionic contamination. The flux is RMA

Product Use: high voltage multiplier

Cleaning Chemicals: Genesolve 2004

Trial Number Date Run Purpose Success Rating
0 02/27/96 To replace the current Genesolve 2004 Results successful using TACT (time, agitation, concentration, and temperature, as well as rinsing and drying) and/or other cleaning chemistries examined. 


Project Number 2



Summary: Attempted to measure contamination using different analytical methods.

Test Objective: Determine how clean is clean

Problems with Current Method: Ineffective, leaves residue

Purpose of Cleaning: To promote potting adhesion and remove electronically conductive materials

Product Use: Power supplies

Cleaning Chemicals: Armakleen

Trial Number Date Run Purpose Success Rating
0 10/07/99 To determine how clean is clean. Develop method to evaluate cleanliness of parts. A cleanliness study, addressing only various analytical techniques. 


Project Number 3



Summary: Projected successfully evaluated the use of Kyzen Ionox HC2 for the removal of surface flux from circuit boards.

Test Objective: To remove surface flux from circuit boards, to remove flux from transformers and to remove epoxy resin from plastic surface.

Problems with Current Method: want to eliminate ensolv and dynsolv due to health issues.

Purpose of Cleaning: remove flux

Cleaning Chemicals: Ensolv, Dynasolv

Trial Number Date Run Purpose Success Rating
0 03/16/01 To evaluate selected cleaners for the removal of flux. Results successful using TACT (time, agitation, concentration, and temperature, as well as rinsing and drying) and/or other cleaning chemistries examined. 
1 03/22/01 To evaluate selected cleaners for the removal of epoxy resin and rubber gasket. Results successful using TACT (time, agitation, concentration, and temperature, as well as rinsing and drying) and/or other cleaning chemistries examined. 
2 05/18/01 To evaluate Kyzne lonoc HC 2 as a replacement for Ensolv for flux removal A follow up test, usually based on company input.